Additively manufactured case.
Assembly of electronics.
The sensor was stress and accuracy tested at different load positions.
Solder stencil created to enable reflow soldering of upgraded electronics.
Note the accelerometer and gyroscope board placement.
Transparent for easier view.
Earlier prototype, lid removed.
Earlier prototype, assembled.
Transparent for easier view of spring and pcb.
Printed and assembled device from same orientation as left.
Note the wide top section, designed to avoid excess pressure in any point.
Actual device from a similar perspective as left.
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